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Bismaleimide Triazine Resin
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- BT resins are
heat-resistant thermosets, made of bismaleimide triazine resin,
co-reacted with epoxy, to give a resin system with some flexibility.
- The proportions
in the blend are varied to produce different properties: a resin
with 10% bismaleimide by weight is used for general purpose circuit
boards, as it has a similar curing temperature to epoxy resins.
- The enhanced heat
resistance of BT resins comes from their ring structure rather than
increasing the density of cross links. This means that they have
relatively good bond strength and are less brittle than epoxies.
- BT resins also
have a low proportion of polar groups, giving lower dielectric
constant than FR-4, low loss, low dissipation factor, and excellent
insulation resistance after moisture absorption: in humid
conditions, their service life is several times that of conventional
glass epoxy boards.
- BT resin has
become the preferred laminate material for many manufacturers
because of its high Tg, low dielectric constant and good insulation
properties. In fact, BT is now apparently the standard substrate
material for BGA's, and is also being used in CSP laminates.
- Mitsubishi Gas Chemical, the
world’s largest producer of bismaleimide-triazine (BT) resin, a
material used to make substrates that connect chips used in handsets
to printed circuit boards.
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General
- BT Epoxy Basic Info
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Resin
Types
MSDS
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Modified BT cured Resin
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BonDuit - Gel Resin – BT
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BT Chelex 100 Resin
Product
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Duraver -BT-Cu
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Dupont CB 102
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BT/Epoxy Laminate
and Prepreg
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BT/Epoxy Laminate
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Nelco
BT/Epoxy Laminate
Company & Suppliers
- Tokyo company
- Supplier for BT resin
Market
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Smart phone makers face chip resin
shortage
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Analysts fear shortage of key resin
Report
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Controlling Moisture in Printed
Circuit Boards
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Recovery plan for
specific BGA & LGA packages raw material
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Risks to BT supply
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PCB Laminate Materials
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BT
resin in full production in May
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IC material supplier in
korea, Taiwan and china developing BT resin
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Limited BT resin
impacts tablet production
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Shortage of epoxy
resin expected after quake
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Study
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In-situ Characterization of
Moisture Absorption and Desorption in a Thin BT Core Substrate
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Curing mechanism and properties of the Bismaleimide-Triazine/ EOVS
composites
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Novel modification
of bismaleimide–triazine resin by reactive hyperbranched
polysiloxane
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Package
Assessment of Fine Pitch Flex Tape and BT-resin Substrate
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Reliability
Study of High-Pin-Count Flip-Chip BGA
Analysis
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Effects of
Bending Fatigue on the Electrical Resistance in Metallic
Films on Flexible Substrates
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A New Built-up Epoxy
Resin PCB Technology for High Density Surface Mount Package and
Device Attachment
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Numerical analysis of thermally
cycled Ball Grid Array solder joints
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Silicon-on-Organic Integration of a 2.4-GHz VCO using high-Q copper
inductors and solder- bumped Flip Chip Technology
Patent
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Bismaleimide triazine composition
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Bismaleimide-triazine resin
and production method thereof
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Bismaleimide-triazine resin bonded
superabrasive wheels
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High
frequency electronic component having base substrate formed of
bismaleimide-triazine resin and resistant film formed on base
substrate
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Flexible printed circuit board base material
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Homogeneous BT epoxy compositions
useful for the manufacture of electrical laminates
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Halogen free triazines, bismaleimide/epoxy polymers, prepregs made
therefrom for circuit boards and resin coated articles, and use
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